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Next: Bus Combiner and Switcher
Up: Mixer Unit
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Four audio mix modules are used in the prototype mixer unit. Figure
83 shows the silkscreen/assembly layer for this PC
board. Table 6 shows the bill of materials for the
audio mix board. Figures 84 and 85 show
the top and bottom routing layers for this board.
Note the presence of surface-mount components on the top routing
layer.
Figure 83:
Audio mix module PCB, silkscreen/assembly drawing.
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Table 6:
Audio Mix Module, bill of materials.
REFDES |
QTY |
DESCRIPTION |
R1 - R8 |
8 |
10K 1% metal film |
C1 - C10 |
10 |
0.1uF monolithic |
C11,C12 |
2 |
10uF electrolytic |
U1 - U4 |
4 |
SSM2163 (SOIC-28) |
U5 |
1 |
GAL16V8 |
U6 |
1 |
74LS373 |
U7 |
1 |
74LS04 |
J1 - J4, J7 - J9 |
8 |
16-pin DIP header |
J5 |
1 |
Molex Mini-Fit Jr. 8-circuit right angle |
J6 |
1 |
20-pin DIP header |
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Figure 84:
Audio mix module PCB, component-side routing.
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Figure 85:
Audio mix module PCB, solder-side routing.
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Next: Bus Combiner and Switcher
Up: Mixer Unit
Previous: Audio Input Module
  Contents
Steve Richardson
2000-07-06
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Table of Contents
[Whole document in PDF 1.9MB]
[more photos and information]
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